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Semiconductor-related ceramic components

應用於半導體/光電製程設備零組件之精密陶瓷零組件，必須具結構強度好、耐高溫、耐高壓、精度好、平行度好、組織緻密均勻、強度高。常見的陶瓷材料有氧化鋁(Al2O3)、氧化鋯(ZrO2)、石英(Quartz)、氮化矽(Si3N4)、碳化矽(SiC)陶瓷等。

Product Introduction

Precision ceramic components used in semiconductor manufacturing equipment must possess high structural strength, high temperature resistance, high pressure resistance, high precision, good parallelism, dense and uniform microstructure, and high strength. Common ceramic materials include alumina, zirconium oxide, silicon nitride, and silicon carbide ceramics.
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